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price tablet and mobile pdf · TravellerLevelB2teachersBook The book was launched at the Whistler Museum. have been long-standing collaborators, working on mezzotint engraving projects together.1. Field of the Invention
The invention relates generally to semiconductor processing, and more particularly to the fabrication of semiconductor devices.
2. Background of the Related Art
Semiconductor technology, especially microelectronics, has experienced extraordinary gains in the past quarter century. A major part of the progress is due to the use of aluminum and aluminum alloys for metallization, especially interconnection metallization. However, with this rapid progress, a major obstacle to further progress is reliability and quality, especially adhesion between the interconnection metallization and the passivation layer.
There are two basic categories of passivation layers used for integrated circuits: organic and inorganic. Organic passivation layers generally provide passivation against moisture and/or oxygen, and are typically made from photoresist or polyimide. Although these organic layers perform well for their intended purposes, they have several drawbacks including poor adhesion to metallic layers. This means that, after etching away the passivation layer, delamination occurs between the metallic layers and the passivation layer. As the dimensions for integrated circuits continue to shrink, it becomes increasingly difficult to fabricate a reliable structure, especially when the dimensions approach and sometimes exceed the critical dimensions of the materials used to fabricate the structure. The passivation of the underbump metallurgy (UBM) structure is particularly challenging because of the small critical dimensions and the high aspect ratio of the UBM.
While an inorganic passivation layer is typically amorphous, organic passivation layers are predominantly crystalline. This crystal orientation provides strength and adhesion. However, this inherent crystal orientation is incompatible with the orientation of the contact used to etch out the UBM. The etch used to etch the contact through the passivation layer is not anisotropic, which means that a portion of the etching proceeds through the organic passivation layer itself. This results in undercut (etching downward into the passivation layer) and undercut etching of the UBM. UBM undercut, in turn, results in a weakening of the UBM.
Consequently, a need exists for a passivation layer that can be deposited over a UBM structure without causing increased undercut
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India hits back at US over Indo-Pak talks

An order to evacuate thousands of US citizens from the strategic region as India moves closer to war with Pakistan is being met with anger in Washington, where many are calling it an embarrassment.

05 Aug 2014 14:59 GMT

Ajit Doval, the top official in the foreign ministry, says India has no plans to change its position.

Indian soldiers with the Border Security Force (BSF) stand on the border near the international border line with Pakistan in Poonch district of Indian-administered Kashmir [Gulshan A Bhat/Reuters]

New Delhi has ordered the evacuation of tens of thousands of its citizens in the border region of Jammu and Kashmir [EPA]

An order to evacuate thousands of US citizens from the strategic region as India moves closer to war with Pakistan is being met with anger in Washington, where many are calling it an embarrassment.

“This is going to be a real public relations disaster for India. I don’t know why India would want to give that image to the world that they’re so desperate that they have to issue something like this,” said Shashi Tharoor, a former Indian minister, diplomat and congressman who was ambassador to the United States.

“It’s both arrogant and dumb at the same time,” he told the Associated Press news agency.

It is the latest event in a series of moves by both sides to ratchet up the tensions in the region.

In the past year, India has carried out airstrikes against Pakistan-based

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