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Forum: . True:
[quote = demon] Truth: In the sense, in this case, and in the previous one (for me) – different things? [/quote] In this case, this is what you said.
For me, it’s one and the same.
Both that, and another – one and the same.
Truth and Truth.
But – different things.
[quote = True] Truth: In the sense, in this case, and in the previous one (for me) – different things? [/quote] In sense, in the given context is one and the same object.
The object we are referring to.
How did you decide that different things?
I’m so

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The present invention relates to a semiconductor device.
Semiconductor devices are generally designed to include a semiconductor substrate having a number of formed devices that are made up of active and passive components, such as transistors, diodes, resistors, capacitors, etc., on the semiconductor substrate. Silicon, which is a semiconductor of choice today, is commonly used in the manufacture of semiconductor devices.
The semiconductor devices are formed in the wafer and then are singulated from the wafer. The semiconductor device is then packaged in a number of ways.
Also, prior to packaging of the semiconductor device, the semiconductor devices in the wafer are tested to ensure proper operation of the semiconductor devices. For this purpose, the semiconductor devices are moved to a test station that applies a test current to each semiconductor device, sequentially, to ensure proper operation of the semiconductor devices. The test station includes a probe card. A probe card, as used in a test station, includes a probe head that is physically formed on the probe card. The probe head includes a number of probe needles that form a number of probe sites on the probe card. Each of the probe sites is associated with a semiconductor device in the wafer, and each of the probe needles contacts a corresponding semiconductor device in the wafer, to apply the test current to the semiconductor device, sequentially, and to determine whether the semiconductor device is good or bad based on whether the semiconductor device passes the test current.
After packaging, the semiconductor device is tested again. That is, the semiconductor device is removably attached to a socket. A connector of the socket, such as a socket lead, physically contacts the semiconductor device to apply a socket voltage to the semiconductor device to determine whether the semiconductor device is good or bad based on whether the semiconductor device passes a predetermined voltage.
A problem with forming the semiconductor device in the wafer and testing the semiconductor device in the wafer is that the structure of the semiconductor device in the wafer is generally not as good as the structure of the semiconductor device in the final package. As a result, the functionality of the semiconductor device in the final package is not effectively tested.
Another problem with forming the semiconductor devices in the wafer and testing the semiconductor devices in the wafer is that the time and cost required to test the semiconductor devices is high. This is especially true when
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